# OpenAI has published a new patent in which it discloses an AI chip housing several compute chiplets, surrounded by a large number of HBM memory stacks.

*semiconductor · news · 2026-04-22 · Wccftech*

## Key points

- OpenAI's new patent details AI chips with multiple compute and HBM chiplets connected by Embedded Logic Bridges.
- These Embedded Logic Bridges extend HBM-to-compute distances from 6mm to 16mm, surpassing JEDEC standards.
- OpenAI's design enables up to 20 HBM memory stacks per compute chiplet, greatly exceeding current memory stack limits.
- The proposed solution is compatible with UCIe standards and parallels Intel's EMIB technology for advanced chip packaging.

**Companies:** OpenAI, Intel
**Countries:** United States

[Read the full story on Wccftech](https://wccftech.com/openai-patent-custom-ai-chip-hbm-memory-stacks-using-intel-emib-like-bridges/)

---

Canonical: https://newsio.io/n/42e84223-ba68-4619-93c8-9ef1a668b216/openai-has-published-a-new-patent-in-which-it-discloses-an-ai-chip-housing-sever
Summarized by Newsio from Wccftech. https://newsio.io/how-it-works