# Huawei says it has developed a new chip design approach it claims could help it achieve cutting-edge semiconductor performance within five years.

*semiconductor · news · 2026-05-25 · International Business Times*

## Key points

- Huawei unveiled a 'LogicFolding' design using vertically stacked chip layers to bypass EUV lithography limits.
- The company introduced the 'Tau Scaling Law' to reduce data travel time in 3D chip architectures.
- Huawei aims for Kirin processors with 1.4-nanometer-class transistor density by 2031, matching global leaders’ targets.
- This approach seeks to sidestep US export controls that restrict access to advanced lithography equipment.

**Companies:** Huawei, Taiwan Semiconductor Manufacturing Company
**Countries:** China, United States, Taiwan

[Read the full story on International Business Times](https://www.ibtimes.com/huawei-claims-chip-design-breakthrough-us-china-tech-rivalry-intensifies-3803296)

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