# Australian firm Syenta secured twenty-six million dollars for a new AI chip manufacturing method.

*semiconductor · news · 2026-04-21 · The Economic Times*

## Key points

- Syenta developed a chip packaging method that reduces copper wiring steps by 40 percent.
- The new process uses electrochemical transfer, enabling faster production of chip base layers.
- Syenta will open a new office in Arizona and former Intel CEO Pat Gelsinger joins its board.
- The company targets high-volume manufacturing of AI chip base layers by 2028.

**Companies:** Intel, Taiwan Semiconductor Manufacturing Co, Syenta, Nvidia, Google
**Countries:** Australia, United States

[Read the full story on The Economic Times](https://economictimes.indiatimes.com/tech/funding/australias-syenta-raises-26-million-to-ease-ai-chip-bottleneck-former-intel-ceo-joins-board/articleshow/130418521.cms)

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