# TSMC showcased progress in its next-generation chipmaking and packaging technologies during the 2026 Taiwan Technology Symposium in Hsinchu on Thursday.

*semiconductor · news · 2026-05-15 · The Tribune*

## Key points

- TSMC's 5.5-reticle-size CoWoS technology has achieved yields exceeding 98 percent, leading the industry.
- TSMC plans to launch five new fabrication plants by 2026 to meet AI and advanced node demand.
- TSMC projects a 70 percent compound annual growth rate for 2nm capacity between 2026 and 2028.
- TSMC received about 25 finalized 2nm chip designs, with 70 more customer projects in development.
- A 14-reticle-size CoWoS platform integrating 20 HBM chips will enter production in 2028.

**Companies:** Taiwan Semiconductor Manufacturing Co
**Countries:** Taiwan

[Read the full story on The Tribune](https://www.tribuneindia.com/news/business/taiwan-tsmc-unveils-advanced-packaging-breakthroughs-and-2nm-roadmap-at-symposium/)

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