# Amkor says that Glass Substrates, a packaging technology replacement for CoWoS spearheaded by Intel, is set for commercialization within 3 years.

*semiconductor · news · 2026-04-28 · Wccftech*

## Key points

- Amkor claims glass substrate packaging will be commercially ready within three years.
- Glass substrates offer superior thermal stability and deformation suppression compared to organic substrates.
- Intel and Amkor are collaborating on glass substrate technology for next-generation AI chip packaging.
- Earlier doubts about glass substrates' stress resistance are being resolved, according to Amkor's team leader.

**Companies:** Intel, Amkor, TSMC
**Countries:** South Korea

[Read the full story on Wccftech](https://wccftech.com/intel-backed-glass-substrates-tech-will-be-commercilization-ready-within-three-years/)

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