The Odisha government has inked an agreement with Intel Corporation and 3DGS Inc. to develop a state-of-the-art semiconductor packaging facility in Bhubaneswar.

The Odisha government has inked an agreement with Intel Corporation and 3DGS Inc. to develop a state-of-the-art semiconductor packaging facility in Bhubaneswar. This initiative, part of India's Semiconductor Mission, represents an investment of approximately USD 3.3 billion. Witnessed virtually by industry leaders, including Intel CEO Lip-Bu Tan and Union Minister of Electronics and IT Ashwini Vaishnaw, the deal underscores a commitment to bolster India's semiconductor ecosystem. Ashwini Vaishnaw highlighted the project's alignment with initiatives to develop a comprehensive semiconductor industry in India, citing partnerships with global firms like Applied Materials and Tokyo Electron as testament to global trust in India's capabilities. Chief Minister Mohan Charan Majhi emphasized the transformative potential of this investment, which aims to position Odisha as a hub for advanced manufacturing and innovation. This venture is poised to generate over 1,800 skilled jobs, attract ancillary businesses, and contribute significantly to India's technological landscape. The facility will specialize in cutting-edge packaging glass core substrates and related technologies, with Intel providing essential technological guidance. Chief Secretary Anu Garg described the project as pivotal for Odisha's growth in semiconductor production, aiming to establish the region as a global leader in this sector. (With inputs from agencies.)

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