# Huawei said its future high-end chips could reach transistor density equivalent to 1.4-nanometre (nm) technology by 2031.

*semiconductor · news · 2026-05-25 · Times Now*

## Key points

- Huawei announced plans to develop 1.4nm-equivalent chips by 2031, despite export controls.
- Huawei introduced the Tau Scaling Law, focusing on system-level data movement over transistor size reductions.
- Huawei's upcoming Kirin smartphone chips will debut the LogicFolding architecture for improved chip performance.
- China's current leading chip production is around 7nm, behind TSMC's 2nm and future 1.4nm processes.

Huawei was placed on a U.S. trade blacklist in 2019. Amid the ongoing AI and chip war between the US and China, tech giant Huawei has announced a major semiconductor breakthrough. According to a Reuters report, the Chinese tech brand is planning to develop industry-leading chips using a new technology within the next five years. At a semiconductor symposium in Shanghai, Huawei said its future high-end chips could reach transistor density equivalent to 1.4-nanometre (nm) technology by 2031. However, the company did not provide independent performance data to support the claim. It is important to note that the US has restricted China's access to advanced chipmaking tools through a series of sanctions and export controls. At present, China's most advanced proven chip production is believed to be around the 7nm level. Meanwhile, Taiwan's TSMC, the world's leading chipmaker, is currently producing 2nm chips and aims to begin mass production of 1.4nm chips in 2028. Huawei said the semiconductor industry can no longer depend only on making transistors smaller to improve performance. To address this challenge, Huawei introduced what it calls the 'Tau Scaling Law'. Instead of making transistors smaller, this approach will focus on boosting chip performance by speeding up how data and signals move within the chip and across computing systems. How Elon Musk And Mark Zuckerberg Helped Stall Trump’s AI Executive Order "What Huawei is proposing is a shift from traditional node-driven scaling to system-level efficiency scaling. Rather than depending solely on smaller transistors, the company is focusing on shortening interconnect, lowering latency and improving data movement inside the chip, which is a credible way to extract more performance when leading-edge lithography is constrained," He Hui, director of semiconductor research at Omdia, was quoted as saying. The stakes are high because advanced chips have become critical for AI. Huawei's Ascend AI chips already power several Chinese AI systems, including the latest models from DeepSeek. Huawei said its Kirin smartphone chips scheduled to launch later this year would be the first to use a Tau Scaling architecture ‌called LogicFolding, which ⁠the company said would shorten wiring inside chips and considerably improve performance. (With Inputs From Reuters) Get Latest News live on Times Now along with Breaking News and Top Headlines from Technology Science and around the world. Latest News Bharat Upadhyay author Bharat Upadhyay is an Assistant News Editor at Times Now, where he currently leads the Tech vertical, covering everything from gadgets and apps, cyber ... View More News Technology & Science End of Article

**Companies:** Huawei, TSMC
**Countries:** China, United States, Taiwan

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