Samsung has started shipping samples of its latest high-bandwidth memory (HBM) chip.

SEOUL, May 29 (Reuters) - Samsung Electronics (005930.KS), opens new tab said on Friday it has started shipping samples ‌of its latest high-bandwidth memory (HBM) chip, or the 12-layer HBM4E, marking what it said was the industry's first shipment of such products. The South Korean tech company said the new chip ⁠represents a more than 20% increase in speed performance over its previous-generation HBM4 products. Sign up here. Samsung said the chip uses its latest 1c DRAM process technology, or sixth-generation 10-nanometer-class DRAM, alongside Samsung's 4-nanometer foundry logic base die. The chipmaker said in April that it planned to ship the first ‌sample ⁠of HBM4E chips in the second quarter. The move comes just three months after Samsung began shipping its HBM4, opens new tab chips to customers in February, underscoring Samsung's efforts ⁠to strengthen its position in the next-generation AI memory market by proactively supplying samples of its latest ⁠products. Samsung's customers include major AI players such as AMD (AMD.O), opens new tab, Nvidia (NVDA.O), opens new tab and Google (GOOGL.O), opens new tab, among others, ⁠as demand surges for advanced memory chips used in AI servers and processors. Reporting by Heekyong Yang and Jack Kim; Editing by Ed Davies

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